with the reduction in height and size of ic packages, there is increased demand for thinner built-in die in silicon devices. therefore, the stress relief process is
1 the gettering effect is a mechanism that forms crystal defects or distortions (= gettering sites) inside the silicon wafer (bulk or backside) and then captures
backgrinding of wafers with large bumps can result in high wafer thickness variation. the final machine dimensions (w d h), mm, 1,400 x 3,312 x 1,870.
from grinding wheels to a future on the tip of a fountain pen. in 1937 kure city, hiroshima, industrial blade and wheel manufacturers were crowded around the
process example. in the normal gaas wafer processing, the 600 wheel is used for rough grinding. disco will recommend a suitable specification for a wheel to
stable high precision processing. dtu1550 is a water supply unit for dicing saws and grinders that provide a stable supply of spindle cooling water or dicing
this new finish grinding wheel is also able to maintain a gettering effect, which is read the operation manual of the cutting/grinding equipment before use.
by selecting the optimum wheel and processing conditions for the glass processing, it is possible to eliminate grinding damage of the glass. the finished surface
follow the instruction manual of the equipment to mount the precision tooling properly. do not drop or hit the precision tooling. this may cause breakage
wafer warpage is caused by imbalance of stress between the front and backside of the wafer. extreme warpage causes a vacuum leak during processing or
small amount of 'dicing and grinding service' must be helpful for customers who can't afford to buy disco machines. they can check their products and it's
the taiko process is a wafer backgrinding method developed by disco. this process method leaves a ring (approximately 3 mm) on the wafer outer edge and
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